VFC301
FOUP and FOSB cleanerThe world’s only dedicated FOUP body and FOUP cover cleaner
VFC301 – The most technologically advanced worldwide FOUP and fosb cleaner
Discover the VFC301, a cutting-edge cleaning solution developed by Innovative System Technology, specifically designed for the semiconductor manufacturing industry. With its unique dual-chamber system, the VFC301 allows for the simultaneous cleaning of FOUP Bodies and Covers, optimizing operational efficiency and significantly reducing cycle times.
World’s N°1 for <30nm IC fabs and wafer/substrate manufacturers
Short delivery
time
6 month delivery
(4 months manufacturing included)
2 years
warranty
Minimum, from installation
date at your site
Historical
partnership
Samsung, HYNIX, SK Siltron
and more !
Friendly user
interface
Fast engineering
for software customization
impressive
reliability
Average of
4 alarms per year
want to know more ?
Vacuum dryer system (3set)
Remove outgassing and impurities •
Moisture reduction •
3 chamber •
Loader/unloader
N2 purge •
Leak check •
<5% humidity check •
Wafer presence sensor •
Tilt unit
FOUP transfer •
FOUP cover separation •
Loader/unloader
N2 purge •
Leak check •
<5% humidity check •
Wafer presence sensor •
Loader/unloader
N2 purge •
Leak check •
<5% humidity check •
Wafer presence sensor •
Clean chamber unit
• Body and cover cleaning & drying
• 3 unit / chambers
• Hot & cold cleaning method
FOUP Transfer robot
• FOUP and cover transfer
• 6 Axis
• 20kg payload
boost your efficiency with the vfc301
key Features:
- High Productivity: The VFC301 can process up to 20 FOUPs per hour, ensuring maximum productivity in your manufacturing processes.
- Humidity Control: Maintains humidity levels below 5%, crucial for protecting sensitive semiconductor components.
- Advanced Cleaning Method: Achieving very low particle count by cleaning body and cover separatly. Utilizes hot and cold deionized water (DIW) to effectively remove particles, achieving a particle count of ≤ 200 (0.1 µm).
- Advanced in-FOUP wafer detection to prevent wafer scrap
Benefits and Features:
- Nâ‚‚ Purge and Leak Check System: This system ensures the integrity of the cleaning process by purging the environment and checking for leaks, maintaining a contamination-free environment.
- Compact and Optimized Design: The VFC301‘s layout is specifically designed for space efficiency, fitting seamlessly into various manufacturing environments without compromising performance.
- Superior vacuum dryer to reach very low residual humidity and outgazing impurities
- Full AMHS compatibility
Unmatched Reliability:
- Mean Time Between Failures (MTBF): Greater than 1,500 hours, providing high reliability and fewer unexpected downtimes.
- Mean Time to Repair (MTTR): Less than 4 hours, enabling a quick recovery from operational issues.
- Alarm Frequency: An average of 0.31 alarms per month, reflecting consistent performance with minimal disruptions.
- Unmatched reliability : very low maintenance and cost of ownership (<2h every 6 months)
the system for your needs
NFC300
Specifications
| Item | NFC300 |
| Uptime | > 98% |
| Technology node | < 30nm |
| Throughput (/Hour) | 18 |
| Dimensions (WxDxH, mm) | 2.140 x 3.290 x 3.215 |
| Number of clean chambers | Body 2 chambers / Cover 2 chambers |
| Vacuum chambers | No |
| Vacuum pump | No |
| N2 Purge quantity  | 1 |
| Halogen heater lamp | No |
| Humidity control | < 20% |
| FOUP leak tester | No |
| Loader / unloader | 2 Loader / 1 Unloader |
| Tilt & Opener | 3 |
| Robot | Four-axis robot |
| Hot D.I Unit | Optionnal |
| Controller & Monitor | 1 |
| FFU | 4 |
| CCD camera | 3 |
| Ionize | 2 |
| SEMI Standards | SEMI E87/E94/E40 |
| Host customer communication | GEM300 |
| OS | English Windows 10 |
VFC301
Specifications
| Item | VFC301 |
| Uptime | > 98% |
| Technology node | < 10nm |
| Throughput (/Hour) | 20 |
| Dimensions (WxDxH, mm) | 2.140 x 3.290 x 3.215 |
| Number of clean chambers | Body 2 chambers / Cover 2 chambers |
| Vacuum chambers | Yes (2) |
| Vacuum pump | Yes (2) |
| N2 Purge quantity  | 3 |
| Halogen heater lamp | Yes |
| Humidity control | < 5% |
| FOUP leak tester | Yes (3) |
| Loader / unloader | 2 Loader / 1 Unloader |
| Tilt & Opener | 3 |
| Robot | Four-axis robot |
| Hot D.I Unit | Optionnal |
| Controller & Monitor | 1 |
| FFU | 4 |
| CCD camera | 3 |
| Ionize | 2 |
| SEMI Standards | SEMI E87/E94/E40 |
| Host customer communication | GEM300 |
| OS | English Windows 10 |
VFC310
Specifications
| Item | VFC310 |
| Uptime | > 98% |
| Technology node | < 10nm |
| Throughput (/Hour) | 30 |
| Dimensions (WxDxH, mm) | 3.000 x 4.800 x 3.120 |
| Number of clean chambers | Body 3 chambers / Cover 3 chambers |
| Vacuum chambers | Yes (3) |
| Vacuum pump | Yes (3) |
| N2 Purge quantity  | 4 |
| Halogen heater lamp | Y |
| Humidity control | < 5% |
| FOUP leak tester | Yes |
| Loader / unloader | 2 Loader / 2 Unloader |
| Tilt & Opener | 4 |
| Robot | Six-axis multi-joint robot |
| Hot D.I Unit | Optionnal |
| Controller & Monitor | 1 |
| FFU | 8 |
| CCD camera | 3 |
| Ionize | 2 |
| SEMI Standards | SEMI E87/E94/E40 |
| Host customer communication | GEM300 |
| OS | English Windows 10 |